Acer
Acer KC.10001.CMP CPU.CEL-1000M/1.8G/1600/35W KC.10001.CMP
- UPC:
- 0000000000000
- MPN:
- KC.10001.CMP
- Condition:
- New
- Availability:
- Available to Order: 3 - 4 weeks leadtime
Description
Cache
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer�s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel�s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Features
CPU configuration (max)
1
Execute Disable Bit
Yes
Graphics & IMC lithography
22 nm
Idle States
Yes
Market segment
Mobile
Maximum number of PCI Express lanes
1
PCI Express configurations
1x16, 2x8, 1x8+2x4
PCI Express slots version
2.0
Supported instruction sets
SSE4.1, SSE4.2
Thermal Monitoring Technologies
Yes
Graphics
Number of displays supported (on-board graphics)
3
On-board graphics card
Yes
On-board graphics card base frequency
650 MHz
On-board graphics card dynamic frequency (max)
1000 MHz
On-board graphics card model
Intel� HD Graphics
Memory
ECC
No
Maximum internal memory supported by processor
32 GB
Memory channels
Dual-channel
Memory clock speeds supported by processor
1333, 1600
Memory types supported by processor
DDR3L-SDRAM
Operational conditions
Tjunction
105 �C
Other features
Intel� Virtualization Technology (Intel� VT)
VT-x
Package dimensions
Gross Weight (Package, kg)
0.05 kg
Power
Thermal Design Power (TDP)
35 Watt
Processor
Box
No
Bus type
DMI
Compatible chipsets
Intel� HM70 Express, Intel� HM75 Express, Intel HM76 Express, Intel HM77 Express, Intel� QM77 Express
Component for
Notebook
L3 cache speed
1.8 GHz
Memory bandwidth supported by processor (max)
25.6 GB/s
Processor base frequency
1.8 GHz
Processor cache
2 MB
Processor cache type
L3
Processor code
SR102
Processor cores
2
Processor family
Intel� Celeron�
Processor frequency
1.8 GHz
Processor lithography
22 nm
Processor model
1000M
Processor operating modes
64-bit
Processor socket
PGA988
Processor threads
2
Stepping
P0
System bus rate
5 GT/s
Thermal Design Power (TDP)
35 Watt
Processor special features
Conflict-Free processor
Yes
Enhanced Intel SpeedStep Technology
Yes
Intel Fast Memory Access
Yes
Intel FDI Technology
Yes
Intel Flex Memory Access
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel� Smart Cache
Yes
Product dimensions
Net Weight (Product, kg)
0.04 kg
Vendor information
Brand Name
Acer
Warranty
3 Month(s)
Weight & dimensions
Processor package size
3.75 cm
View AllClose
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer�s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel�s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Features
CPU configuration (max)
1
Execute Disable Bit
Yes
Graphics & IMC lithography
22 nm
Idle States
Yes
Market segment
Mobile
Maximum number of PCI Express lanes
1
PCI Express configurations
1x16, 2x8, 1x8+2x4
PCI Express slots version
2.0
Supported instruction sets
SSE4.1, SSE4.2
Thermal Monitoring Technologies
Yes
Graphics
Number of displays supported (on-board graphics)
3
On-board graphics card
Yes
On-board graphics card base frequency
650 MHz
On-board graphics card dynamic frequency (max)
1000 MHz
On-board graphics card model
Intel� HD Graphics
Memory
ECC
No
Maximum internal memory supported by processor
32 GB
Memory channels
Dual-channel
Memory clock speeds supported by processor
1333, 1600
Memory types supported by processor
DDR3L-SDRAM
Operational conditions
Tjunction
105 �C
Other features
Intel� Virtualization Technology (Intel� VT)
VT-x
Package dimensions
Gross Weight (Package, kg)
0.05 kg
Power
Thermal Design Power (TDP)
35 Watt
Processor
Box
No
Bus type
DMI
Compatible chipsets
Intel� HM70 Express, Intel� HM75 Express, Intel HM76 Express, Intel HM77 Express, Intel� QM77 Express
Component for
Notebook
L3 cache speed
1.8 GHz
Memory bandwidth supported by processor (max)
25.6 GB/s
Processor base frequency
1.8 GHz
Processor cache
2 MB
Processor cache type
L3
Processor code
SR102
Processor cores
2
Processor family
Intel� Celeron�
Processor frequency
1.8 GHz
Processor lithography
22 nm
Processor model
1000M
Processor operating modes
64-bit
Processor socket
PGA988
Processor threads
2
Stepping
P0
System bus rate
5 GT/s
Thermal Design Power (TDP)
35 Watt
Processor special features
Conflict-Free processor
Yes
Enhanced Intel SpeedStep Technology
Yes
Intel Fast Memory Access
Yes
Intel FDI Technology
Yes
Intel Flex Memory Access
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel� Smart Cache
Yes
Product dimensions
Net Weight (Product, kg)
0.04 kg
Vendor information
Brand Name
Acer
Warranty
3 Month(s)
Weight & dimensions
Processor package size
3.75 cm