Acer KC.20201.DEG CPU P-DUO.G2020/2.9G/3M/1333/5 KC.20201.DEG

Cache
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer�s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel�s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Features



CPU configuration (max)



1


Execute Disable Bit



Yes


Graphics & IMC lithography



22 nm


Idle States



Yes


Market segment



Desktop


PCI Express configurations



1x16, 2x8, 1x8+2x4


PCI Express slots version



2.0


Supported instruction sets



SSE4.1, SSE4.2


Thermal Monitoring Technologies



Yes


Thermal solution specification



PCG 2011C


Graphics



Number of displays supported (on-board graphics)



3


On-board graphics card



Yes


On-board graphics card base frequency



650 MHz


On-board graphics card dynamic frequency (max)



1050 MHz


On-board graphics card model



Intel� HD Graphics


Memory



ECC



Yes


Maximum internal memory supported by processor



32 GB


Memory channels



Dual-channel


Memory clock speeds supported by processor



1333


Memory types supported by processor



DDR3-SDRAM


Other features



Intel� Virtualization Technology (Intel� VT)



VT-x


Package dimensions



Gross Weight (Package, kg)



0.05 kg


Power



Thermal Design Power (TDP)



55 Watt


Processor



Box



No


Bus type



DMI


Component for



PC


L3 cache speed



2.9 GHz


Memory bandwidth supported by processor (max)



21 GB/s


Processor base frequency



2.9 GHz


Processor cache



3 MB


Processor cache type



L3


Processor cores



2


Processor family



Intel� Pentium�


Processor frequency



2.9 GHz


Processor lithography



22 nm


Processor model



G2020


Processor operating modes



64-bit


Processor socket



LGA 1155 (Socket H2)


Processor threads



2


System bus rate



5 GT/s


Thermal Design Power (TDP)



55 Watt


Processor special features



Conflict-Free processor



Yes


Enhanced Intel SpeedStep Technology



Yes


Intel Virtualization Technology (VT-x)



Yes


Intel VT-x with Extended Page Tables (EPT)



Yes


Intel� Smart Cache



Yes


Product dimensions



Net Weight (Product, kg)



0.04 kg


Vendor information



Brand Name


Acer


Warranty



3 Month(s)


Weight & dimensions



Processor package size



3.75 cm