Hewlett Packard Enterprise
Hewlett Packard Enterprise 463509-001 Processor E3110 3.0GHz 463509-001
- UPC:
- 5711045290695
- MPN:
- 463509-001
- Condition:
- New
- Availability:
- Available to Order: 3 - 4 weeks leadtime
Description
The Dual-Core Intel� Xeon� Processor 3100 Series, like the previous Dual-Core Intel� Xeon� Processor 3000 Series, are based on the Intel� Core� microarchitecture. The Intel Core microarchitecture combines the performance of previous generation products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems. The Dual-Core Intel� Xeon� Processor 3100 Series is a 64-bit processor that maintains compatibility with IA-32 software.
The processor is a dual-core processor, based on 45-nm process technology. The processor features the Intel� Advanced Smart Cache, a shared multi-core optimized cache that significantly reduces latency to frequently used data. The processor features a 1333 MHz front side bus (FSB) and 6 MB of L2 cache. The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental Streaming SIMD Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 (SSE4.1). The processor supports several Advanced Technologies: Execute Disable Bit, Intel� 64 architecture, Enhanced Intel SpeedStep� Technology, Intel� Virtualization Technology (Intel� VT), and Intel� Trusted Execution Technology (Intel� TXT).
The processor's front side bus (FSB) utilizes a split-transaction, deferred reply protocol. The FSB uses Source-Synchronous Transfer of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.
Features
Embedded options available
No
Execute Disable Bit
Yes
Idle States
Yes
Market segment
Server
Number of Processing Die Transistors
410 M
Processing Die size
107 mm�
Thermal Monitoring Technologies
Yes
Graphics
On-board graphics card
No
Operational conditions
Tcase
72.4 �C
Other features
Intel� Virtualization Technology (Intel� VT)
VT-x
Package dimensions
Depth (package,cm)
33 cm
Gross Weight (Package, kg)
0.28 kg
Height (package,cm)
6.3 cm
Width (package,cm)
26.8 cm
Power
Thermal Design Power (TDP)
65 Watt
VID Voltage Range
0.85 - 1.3625 V
Processor
Component for
Server/workstation
FSB Parity
No
Processor base frequency
3 GHz
Processor cache
6 MB
Processor cache type
L2
Processor cores
2
Processor family
Intel� Xeon� 3000 Sequence
Processor frequency
3 GHz
Processor front side bus
1333 MHz
Processor lithography
45 nm
Processor model
E3110
Processor operating modes
64-bit
Processor socket
LGA 775 (Socket T)
Thermal Design Power (TDP)
65 Watt
VID Voltage Range
0.85 - 1.3625 V
Processor special features
Enhanced Intel SpeedStep Technology
Yes
Intel Demand Based Switching
No
Intel Trusted Execution Technology
No
Intel Virtualization Technology (VT-x)
Yes
Intel� Hyper Threading Technology (Intel� HT Technology)
No
Intel� Turbo Boost Technology
No
Product dimensions
Net Weight (Product, kg)
0.2 kg
Vendor information
Brand Name
Hewlett Packard Enterprise
Warranty
3 Year(s)
View AllClose
The processor is a dual-core processor, based on 45-nm process technology. The processor features the Intel� Advanced Smart Cache, a shared multi-core optimized cache that significantly reduces latency to frequently used data. The processor features a 1333 MHz front side bus (FSB) and 6 MB of L2 cache. The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental Streaming SIMD Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 (SSE4.1). The processor supports several Advanced Technologies: Execute Disable Bit, Intel� 64 architecture, Enhanced Intel SpeedStep� Technology, Intel� Virtualization Technology (Intel� VT), and Intel� Trusted Execution Technology (Intel� TXT).
The processor's front side bus (FSB) utilizes a split-transaction, deferred reply protocol. The FSB uses Source-Synchronous Transfer of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.
Features
Embedded options available
No
Execute Disable Bit
Yes
Idle States
Yes
Market segment
Server
Number of Processing Die Transistors
410 M
Processing Die size
107 mm�
Thermal Monitoring Technologies
Yes
Graphics
On-board graphics card
No
Operational conditions
Tcase
72.4 �C
Other features
Intel� Virtualization Technology (Intel� VT)
VT-x
Package dimensions
Depth (package,cm)
33 cm
Gross Weight (Package, kg)
0.28 kg
Height (package,cm)
6.3 cm
Width (package,cm)
26.8 cm
Power
Thermal Design Power (TDP)
65 Watt
VID Voltage Range
0.85 - 1.3625 V
Processor
Component for
Server/workstation
FSB Parity
No
Processor base frequency
3 GHz
Processor cache
6 MB
Processor cache type
L2
Processor cores
2
Processor family
Intel� Xeon� 3000 Sequence
Processor frequency
3 GHz
Processor front side bus
1333 MHz
Processor lithography
45 nm
Processor model
E3110
Processor operating modes
64-bit
Processor socket
LGA 775 (Socket T)
Thermal Design Power (TDP)
65 Watt
VID Voltage Range
0.85 - 1.3625 V
Processor special features
Enhanced Intel SpeedStep Technology
Yes
Intel Demand Based Switching
No
Intel Trusted Execution Technology
No
Intel Virtualization Technology (VT-x)
Yes
Intel� Hyper Threading Technology (Intel� HT Technology)
No
Intel� Turbo Boost Technology
No
Product dimensions
Net Weight (Product, kg)
0.2 kg
Vendor information
Brand Name
Hewlett Packard Enterprise
Warranty
3 Year(s)
Additional Information
Shipping: |
Available to Order - Call for ETA |
Delivery: |
Available to Order - Call for ETA |